![]() This technology bypasses previous challenges related to high temperatures and material transfer imperfections. Researchers from MIT have developed a low-temperature growth process to directly integrate 2D materials onto silicon chips, enabling denser and more powerful semiconductors. ![]() The new method involves growing layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a silicon chip, a process that typically requires high temperatures that could damage the silicon.Ī new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips. MIT researchers have innovated a low-temperature growth technology to integrate 2D materials onto a silicon circuit, paving the way for denser and more powerful chips.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |